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4 Dec: National Conference On Electronics Design, Assembly And Reliability
 
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4 Dec: National Conference On Electronics Design, Assembly And Reliability  
 
   
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Thursday, June 14, 2012 IPC India is organizing a national conference and exhibition from 4 December to 6 December 2012 at the prestigious Indian Institute of Science, Bangalore, for the benefit of Indian industry. The event is conducted in technical cooperation with the Department of Electronic Systems Engineering (DESE), Indian Institute of Science, Bangalore.






CALL FOR PAPERS

Present your work at the IPC National Conference on Electronics Design, Assembly & Reliability and make an impact as an industry expert at this inaugural event.

As a speaker, you will be positioned as a subject matter expert in IPC communications distributed to a global audience and event participants. This is a unique and cost-effective channel for promoting your organization's capabilities and an opportunity to make a contribution to the industry.

Topics of interest Include - but are not limited to:
IM1

Electronics packaging
Electronics components and RF
Emerging technologies including embedded passives and actives
EMI/EMC design criteria
CAD and signal integrity
Interconnections on PWB and advanced PWB technologies, ceramic technologies
Surface mount technology - design and manufacturing
Materials and processing
Cable and wire harness
Design for ESD, manufacturing, reliability and test
Yield and quality control in manufacturing
Solders, lead-free solders and RoHS
Electric test

Requirements for Submission

Your submission must be received by August 15, 2012:

An abstract of 250 to 300 words that summarizes recent technical work - case histories, research and discoveries
Your professional biography
Complete contact information

Your presentation should be noncommercial in nature and describe significant results from experiments, emphasize new techniques, discuss trends of interest or contain technical and/or appropriate test results. Suggested time for presentations is 25 minutes.

How to Submit

To submit your proposal for a conference agenda presentation, or to learn about conference participation, please email ncedar@ipc.org.

Timeline

August 15 - Your submission is due
September 1- You will be notified regarding status of the proposal
October 15 - Your print-ready full paper in PDF will be due to IPC

Benefits

Conference speakers will receive complimentary admission to the two-day conference and exhibition.
Complimentary event proceedings & conference kit
Opportunity for Networking among the leading technology experts
Roster of participants


EXHIBITOR OPPORTUNITIES

This conference is a business development opportunity you do not want to miss! A brand new, high-profile conference featuring two full days of exposure to your prospects.

Build or reinforce your position as an industry leader by leveraging conference speaker opportunities to show off your company's latest technical research and innovations.

Network with colleagues, industry experts and more.

Gold Exhibitor

Speaking opportunity
One technical conference session to share your solutions, best practices and case studies
3x3 m exhibit space
Full page advertisement in conference proceedings
Pre-conference marketing
Logo on all printed materials and agenda on-site
Logo on all electronic promotional material
Logo on conference website
Audio speaker interview produced by IPC for social media promotion
List of conference attendees after the conference
Two conference passes

Silver Exhibitor

3x3 m or 3x2 m exhibit space
Half-page advertisement in conference proceedings
Pre-conference marketing
Logo on all printed materials and agenda on-site
Logo on all electronic promotional material
Logo on conference website
List of conference attendees after the conference
One conference pass

Attendees are looking for equipment, systems and supplies in these major product categories:

Adhesives, Coatings, Chemicals, and Materials
Assembly Systems, Tools, and Fixtures - Automatic, Semi-Automatic, Manual
Cleaning Equipment and Supplies - Aqueous, Ultrasonic
Components - Active, Passive, SMT and Flip Chip
Connectors, Sockets & Backplanes
Drilling, Routing & Tooling
EOS/ESD Packaging and Supplies
Electronic Manufacturing Services (EMS)/Contract Manufacturing
Enclosures/Cabinets
Laminates and PCB Materials
Material Handling Systems and Conveyors
Pick and Place Equipment - Automatic, Semi-Automatic
Printed Circuit Boards
Production Hand Tools and Supplies
Rework and Repair Tools and Kits
Semiconductor Packaging Equipment
Screen and Stencil Printing
Services - Consulting and Training
Solder Cream/Paste/Powder and Fluxes
Soldering Equipment - Reflow, Wave, Infrared
Tape and Reel Equipment and Supplies
Test, Inspection and Measurement Equipment and Services

REGISTRATION

Conference admission

To register for workshops and/or the technical conference, please email ncedar@ipc.org

Register before August 31st and receive Early Bird rates!
Early Bird technical conference rates will only be available to the first 100 registrants before August 31st!
Early Bird Workshops rates will only be available for the first 50 registrants before August 31st!



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