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On the Road Toward TSV Manufacturing
 
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On the Road Toward TSV Manufacturing  
 
SEMI Europe announced that it is organising a new event, the European 3D TSV Summit on January 22-23, 2013 in Grenoble, France.    
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Thursday, July 26, 2012 The theme of the first-ever Summit is 'On the Road toward TSV Manufacturing,' a critical issue as device designers and manufacturers increasingly cross into the third dimension (3D) due to the industry’s continuing pursuit of building more functionality into ever-shrinking silicon 'real estate.' Many European semiconductor companies are now worldwide leaders in 3D-integrated circuits (IC); the event will support and showcase their capabilities to global leaders in the field.





IC device requirements continue to increase as applications get more complex and more multifunctional. Europe's high-tech industry has responded to these new requirements with 3D-IC integration with TSV. TSV is the key technology behind 3D-IC integration, and is a stepping stone to get the most out of the combination of 'More Moore' and 'More than Moore.'

Such integration explores a new area of microelectronics, reaching beyond the boundaries of conventional semiconductor 'Moore's Law' downscaling. 3D-IC integration focuses on creating high-value products, encouraging new technological possibilities and almost unlimited application potential.

According to Yole Developpment, the shipment volume of 3D-IC wafers will reach 10 million units in 2012.

The European 3D TSV Summit is likely to demonstrate the full range of 3D technology and R&D processes in Europe, with leading companies participating, showing a range from initial prototypes to high-volume production.

The show is targeted both at engineers up through top executives from European fabs, IDMs, TSV companies, equipment and materials companies and fabless, and attendees from all over the world who are interested in European capabilities. In addition to the conference and an exhibition, attendees will get opportunities to network and participate in round table talks.

The European 3D TSV Summit steering committee includes: Wilfried Bair, VP of Strategic Business Development, SUSS Microtec; Eric Beyne, director of Advanced Packaging, IMEC; Kevin Crofton; EVP and COO, SPTS; Hannes Kostner, director of R&D, Datacon; Thorsten Matthias, director of Business Development, EV Group; Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics; James Quinn, VP of Marketing and Sales, Multitest; Martin Schrems, director of R&D, austriamicrosystems; Nicolas Sillon, head of 3D Integration, CEA-Leti; and Juergen Wolf, department head of HDI WLP/ ASSID, Fraunhofer-IZM.



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