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Avago Launches New WaferCap CSP Technology Avago Launches New WaferCap CSP Technology
 
The semiconductor-based chip scale packaging technology can reduce the amount of PCB space an RF device occupies by over 50 per cent.
EFY News Network  (729)

Friday, May 16, 2008:  Avago Technologies has announced new WaferCap CSP technology. WaferCap is a semiconductor-based chip scale packaging (CSP) technology which has the potential to reach the 100 GHz frequency range for a SMT packaging. WaferCap CSP has the same dimensions as an 0402 component and can reduce the amount of PCB space an RF device occupies by over 50 per cent, says the company.
Currently measuring 1.0 mm x 0.5 mm and a height of 0.25 mm, WaferCap packaged parts reduce the thickness of any assembly. With WaferCap, the air cavity created under the 'lid' and immediately above the circuit makes it possible to achieve higher frequency ranges.

The micro-miniaturisation benefits of WaferCap CSP reduce the number of required components around the device and open up PCB space in an RF design. The elimination of wire bonds in the packaging process gives the device the flexibility to fit in a variety of positions in a wide range of RF architectures.

No special tooling is required as assembly is done with standard SMT techniques. The devices can be directly soldered onto a board using standard soldering techniques. Traditional mass production 'pick and place' or chip shooter machines can easily place a WaferCap packaged device onto any RF architecture.

Products based on Avago’s innovative WaferCap CSP are available today. The recently announced miniature VMMK-12xx FETs are shipping now.

EFY News Network


 
 
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